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PCB(Blind&Buried Via)
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| Specifications |
Blind&Buried Via |
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Products High layer counts (24+ layers) RoHS Compliance Minimum conductor width/***cing: 0.08/0.08mm (advanced) Minimum drill bit 0.15mm Lead free HAL/HAL/OSP/Immersion silver/Immersion Ni,Au/Immersion Tin/Flash gold/Gold finger Controlled depth drill/profile Sequential lamination Buried and blind via Heavy Copper PCB's Up to 5oz Controlled Impedance
Material FR-4 (130TG-180TG) Halogen free laminate Rogers Teflon Aluminum Based ISOLA ARLON
Characteristic: 16 Layer,Blind&Buried Via
Application: Secondary Power Supply,Applied Electronic,etc
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| Company: |
Shenzhen Swzerling Accurate Technologica Co., Ltd
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| Contact: |
Mr. Brain Xu |
| Address: |
Room F6011,Block A,Hedong Building,Xixiang Town, Bao'an District |
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| Tel: |
0755-26478971 |
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0755-26478970 |
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